Total
214 CVE
| CVE | Vendors | Products | Updated | CVSS v2 | CVSS v3 |
|---|---|---|---|---|---|
| CVE-2017-18324 | 1 Qualcomm | 64 Mdm9206, Mdm9206 Firmware, Mdm9607 and 61 more | 2024-11-21 | 2.1 LOW | 5.5 MEDIUM |
| Cryptographic key material leaked in debug messages - GERAN in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, SD 855, SDX24, Snapdragon_High_Med_2016. | |||||
| CVE-2017-18322 | 1 Qualcomm | 62 Mdm9206, Mdm9206 Firmware, Mdm9607 and 59 more | 2024-11-21 | 2.1 LOW | 5.5 MEDIUM |
| Cryptographic key material leaked in WCDMA debug messages in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016. | |||||
| CVE-2017-18320 | 1 Qualcomm | 64 Msm8996au, Msm8996au Firmware, Sd 410 and 61 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
| QSEE unload attempt on a 3rd party TEE without previously loading results in a data abort in snapdragon automobile and snapdragon mobile in versions MSM8996AU, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016, SXR1130. | |||||
| CVE-2017-18319 | 1 Qualcomm | 60 Mdm9206, Mdm9206 Firmware, Mdm9607 and 57 more | 2024-11-21 | 2.1 LOW | 5.5 MEDIUM |
| Information leak in UIM API debug messages in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016. | |||||
| CVE-2017-18318 | 1 Qualcomm | 24 Msm8996au, Msm8996au Firmware, Sd 410 and 21 more | 2024-11-21 | 10.0 HIGH | 9.8 CRITICAL |
| Missing validation check on CRL issuer name in Snapdragon Automobile, Snapdragon Mobile in versions MSM8996AU, SD 410/12, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A. | |||||
| CVE-2017-18312 | 1 Qualcomm | 18 Msm8996au, Msm8996au Firmware, Sd 410 and 15 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
| While accessing SafeSwitch services, third party can manipulate a given device and perform unauthorized operation due to lack of checking of same state transitions in Snapdragon Automobile, Snapdragon Mobile in version MSM8996AU, SD 410/12, SD 617, SD 650/52, SD 810, SD 820, SD 820A | |||||
| CVE-2017-18311 | 1 Qualcomm | 70 Mdm9607, Mdm9607 Firmware, Mdm9635m and 67 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
| XPU Master privilege escalation is possible due to improper access control of unused configuration xPU ports where unused configuration ports are open in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016. | |||||
| CVE-2017-18310 | 1 Qualcomm | 62 Msm8909w, Msm8909w Firmware, Msm8996au and 59 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
| ClientEnv exposes services 0-32 to HLOS in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016 | |||||
| CVE-2017-18304 | 2 Qaulcomm, Qualcomm | 52 Fsm9055, Fsm9055 Firmware, Mdm9206 and 49 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
| Insufficient memory allocation in boot due to incorrect size being passed could result in out of bounds access in Small Cell SoC, Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in version FSM9055, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660 and SDX20 | |||||
| CVE-2017-18303 | 1 Qualcomm | 52 Mdm9206, Mdm9206 Firmware, Mdm9607 and 49 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
| While processing the sensors registry configuration file, if inputs are not validated a buffer overflow will occur in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MMDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A, SD 835, SDA660, SDX20. | |||||
| CVE-2017-18298 | 1 Qualcomm | 52 Mdm9206, Mdm9206 Firmware, Mdm9607 and 49 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
| Lack of Input Validation in SDMX API can lead to NULL pointer access in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660 . | |||||
| CVE-2017-18292 | 1 Qualcomm | 42 Msm8909w, Msm8909w Firmware, Msm8996au and 39 more | 2024-11-21 | 4.9 MEDIUM | 5.5 MEDIUM |
| Secure app running in non secure space can restart TZ by calling Widevine app API repeatedly in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A. | |||||
| CVE-2017-18279 | 1 Qualcomm | 78 Fsm9055, Fsm9055 Firmware, Fsm9955 and 75 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
| Lack of check of buffer length before copying can lead to buffer overflow in camera module in Small Cell SoC, Snapdragon Mobile, Snapdragon Wear in FSM9055, FSM9955, IPQ4019, IPQ8064, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA9531, QCA9558, QCA9563, QCA9880, QCA9886, QCA9980, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016. | |||||
| CVE-2017-18277 | 1 Qualcomm | 46 Mdm9206, Mdm9206 Firmware, Mdm9607 and 43 more | 2024-11-21 | 4.9 MEDIUM | 5.5 MEDIUM |
| When dynamic memory allocation fails, currently the process sleeps for one second and continues with infinite loop without retrying for memory allocation in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, QCN5502, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 600, SD 615/16/SD 415, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835. | |||||
| CVE-2017-18173 | 1 Qualcomm | 26 Sd 425, Sd 425 Firmware, Sd 427 and 23 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
| In case of using an invalid android verified boot signature with very large length, an integer underflow occurs in Snapdragon Mobile in SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016. | |||||
| CVE-2017-18172 | 1 Qualcomm | 48 Mdm9635m, Mdm9635m Firmware, Sd 400 and 45 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
| In a device, with screen size 1440x2560, the check of contiguous buffer will overflow on certain buffer size resulting in an Integer Overflow or Wraparound in System UI in Snapdragon Automobile, Snapdragon Mobile in version MDM9635M, SD 400, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016. | |||||
| CVE-2017-18146 | 1 Qualcomm | 56 Mdm9206, Mdm9206 Firmware, Mdm9607 and 53 more | 2024-11-21 | 10.0 HIGH | 9.8 CRITICAL |
| In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, in some corner cases, ECDSA signature verification can fail. | |||||
| CVE-2017-18141 | 1 Qualcomm | 68 Ipq8074, Ipq8074 Firmware, Mdm9206 and 65 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
| When a 3rd party TEE has been loaded it is possible for the non-secure world to create a secure monitor call which will give it access to privileged functions meant to only be accessible from the TEE in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016. | |||||
| CVE-2017-18140 | 1 Qualcomm | 48 Mdm9206, Mdm9206 Firmware, Mdm9607 and 45 more | 2024-11-21 | 10.0 HIGH | 9.8 CRITICAL |
| In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, when processing a call disconnection, there is an attempt to print the RIL token-id to the debug log. If eMBMS service is enabled while processing the call disconnect, a Use After Free condition may potentially occur. | |||||
| CVE-2017-18139 | 1 Qualcomm | 60 Mdm9206, Mdm9206 Firmware, Mdm9607 and 57 more | 2024-11-21 | 10.0 HIGH | 9.8 CRITICAL |
| In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 835, SD 845, SD 850, a buffer overflow vulnerability may potentially exist while making an IMS call. | |||||