Total
326 CVE
CVE | Vendors | Products | Updated | CVSS v2 | CVSS v3 |
---|---|---|---|---|---|
CVE-2020-11119 | 1 Qualcomm | 942 Apq8009, Apq8009 Firmware, Apq8017 and 939 more | 2024-11-21 | 5.0 MEDIUM | 7.5 HIGH |
Buffer over-read can happen when the buffer length received from response handlers is more than the size of the payload in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | |||||
CVE-2018-5871 | 1 Qualcomm | 62 Mdm9206, Mdm9206 Firmware, Mdm9607 and 59 more | 2024-11-21 | 3.3 LOW | 6.5 MEDIUM |
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6574AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016, MAC address randomization performed during probe requests (for privacy reasons) is not done properly due to a flawed RNG which produces repeating output much earlier than expected. | |||||
CVE-2018-5837 | 1 Qualcomm | 56 Ipq8074, Ipq8074 Firmware, Mdm9206 and 53 more | 2024-11-21 | 5.0 MEDIUM | 7.5 HIGH |
In Snapdragon (Automobile, Mobile, Wear) in version IPQ8074, MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6574AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016, MAC address randomization performed during probe requests is not done properly due to a flawed RNG which produced repeating output much earlier than expected. | |||||
CVE-2018-11982 | 1 Qualcomm | 56 Mdm9206, Mdm9206 Firmware, Mdm9607 and 53 more | 2024-11-21 | 8.3 HIGH | 8.8 HIGH |
In Snapdragon (Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016, a double free of ASN1 heap memory used for EUTRA CAP container occurs during UTRAN to LTE Capability inquiry procedure. | |||||
CVE-2018-11291 | 1 Qualcomm | 72 Ipq8074, Ipq8074 Firmware, Mdm9206 and 69 more | 2024-11-21 | 5.0 MEDIUM | 7.5 HIGH |
In Snapdragon (Automobile, Mobile, Wear) in version IPQ8074, MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA4531, QCA6174A, QCA6564, QCA6574, QCA6574AU, QCA6584, QCA6584AU, QCA9377, QCA9378, QCA9379, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, cryptographic issues due to the random number generator was not a strong one in NAN. | |||||
CVE-2018-11287 | 1 Qualcomm | 58 Mdm9206, Mdm9206 Firmware, Mdm9607 and 55 more | 2024-11-21 | 10.0 HIGH | 9.8 CRITICAL |
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016, incorrect control flow implementation in Video while checking buffer sufficiency. | |||||
CVE-2018-11285 | 1 Qualcomm | 64 Mdm9206, Mdm9206 Firmware, Mdm9607 and 61 more | 2024-11-21 | 9.3 HIGH | 7.8 HIGH |
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, while parsing FLAC file with corrupted picture block, a buffer over-read can occur. | |||||
CVE-2018-11277 | 1 Qualcomm | 40 Msm8909w, Msm8909w Firmware, Msm8996au and 37 more | 2024-11-21 | 4.6 MEDIUM | 7.8 HIGH |
In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue. | |||||
CVE-2018-11269 | 1 Qualcomm | 70 Mdm9206, Mdm9206 Firmware, Mdm9607 and 67 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options. | |||||
CVE-2018-11268 | 1 Qualcomm | 70 Mdm9206, Mdm9206 Firmware, Mdm9607 and 67 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options. | |||||
CVE-2018-11267 | 1 Qualcomm | 78 Mdm9206, Mdm9206 Firmware, Mdm9607 and 75 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, when sending an malformed XML data to deviceprogrammer/firehose it may do an out of bounds buffer write allowing a region of memory to be filled with 0x20. | |||||
CVE-2017-18314 | 1 Qualcomm | 74 Mdm9206, Mdm9206 Firmware, Mdm9607 and 71 more | 2024-11-21 | 10.0 HIGH | 9.8 CRITICAL |
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, on TZ cold boot the CNOC_QDSS RG0 locked by xBL_SEC is cleared by TZ. | |||||
CVE-2017-18302 | 1 Qualcomm | 38 Msm8996au, Msm8996au Firmware, Sd425 and 35 more | 2024-11-21 | 4.7 MEDIUM | 4.7 MEDIUM |
In Snapdragon (Automobile ,Mobile) in version MSM8996AU, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, a crafted HLOS client can modify the structure in memory passed to a QSEE application between the time of check and the time of use, resulting in arbitrary writes to TZ kernel memory regions. | |||||
CVE-2017-18301 | 1 Qualcomm | 46 Fsm9055, Fsm9055 Firmware, Fsm9955 and 43 more | 2024-11-21 | 4.9 MEDIUM | 5.5 MEDIUM |
In Small Cell SoC and Snapdragon (Automobile, Mobile, Wear) in version FSM9055, FSM9955, MDM9607, MDM9640, MDM9650, MSM8909W, SD 425, SD 427, SD 430, SD 435, SD 450, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDM630, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, providing the NULL argument of ICE regulator while processing create key IOCTL results in system restart. | |||||
CVE-2017-18282 | 1 Qualcomm | 28 Mdm9206, Mdm9206 Firmware, Mdm9607 and 25 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
Non-secure SW can cause SDCC to generate secure bus accesses, which may expose RPM access in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 835, SDA660. | |||||
CVE-2017-18280 | 1 Qualcomm | 42 Mdm9607, Mdm9607 Firmware, Msm8909w and 39 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
In Snapdragon (Automobile, Mobile, Wear) in version MDM9607, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDM429, SDM439, SDM632, Snapdragon_High_Med_2016, when a Trusted Application has opened the SPI/I2C interface to a particular device, it is possible for another Trusted Application to read the data on this open interface by calling the SPI/I2C read function. | |||||
CVE-2024-33014 | 1 Qualcomm | 650 315 5g Iot Modem, 315 5g Iot Modem Firmware, 860 Mobile Platform and 647 more | 2024-11-20 | N/A | 7.5 HIGH |
Transient DOS while parsing ESP IE from beacon/probe response frame. | |||||
CVE-2024-38423 | 1 Qualcomm | 412 205 Mobile Platform, 205 Mobile Platform Firmware, 215 Mobile Platform and 409 more | 2024-11-07 | N/A | 7.8 HIGH |
Memory corruption while processing GPU page table switch. | |||||
CVE-2024-38422 | 1 Qualcomm | 536 205 Mobile Platform, 205 Mobile Platform Firmware, 215 Mobile Platform and 533 more | 2024-11-07 | N/A | 7.8 HIGH |
Memory corruption while processing voice packet with arbitrary data received from ADSP. | |||||
CVE-2024-23379 | 1 Qualcomm | 68 Fastconnect 6900, Fastconnect 6900 Firmware, Fastconnect 7800 and 65 more | 2024-10-16 | N/A | 6.7 MEDIUM |
Memory corruption while unmapping the fastrpc map when two threads can free the same map in concurrent scenario. |